Applications

Antennas  |  Capacitors  |  Connectors  |  Electrical Assemblies
IC Chip Carrier  |  Pin Grid Array  |  Lead Frames  |  Motors
Sensors  |  Solenoids  |  Switches  |  Toroids  |  Transformers

	Antennas The intimate contact of encapsulated plastic over wire-wound devices allows significant removal of thermal energy. Encap performs ANSYS-based thermal design analyses to evaluate and optimize the potential encapsulants and system design. Plastic acts as a thermal pathway, not a heat sink, and as such it is critical to design the component with this consideration in mind. When designs are optimized, relatively low heat rises can be created, as evidenced by the image below, showing a small, encapsulated high-speed spindle motor for the hard drive industry.

	Capacitors This lighting manufacturer wound a metallized polypropylene film on an electrically conductive polyester core. After soldering leads to the zinc ends the component is overmolded with an acetal. Retracting pins precisely position the insert and allow complete hermetic packaging.

	Connectors This antilock braking component used nylon to integrate a printed circuit board into the connector.

	Electrical Assemblies An acetal was used to replace the traditional epoxy potting of these components. Note that crimp connections allowed this manufacturer to eliminate the circuit board and wave soldering steps.

	IC Chip Carriers This IC manufacturer uses PPS to create the carrier frame. Dimensional tolerances of ±.0005 inches are maintained while eliminating flash around the .006 inch thick inserts.

	Pin Grid Array Automated mold insertion of these .018 inch diameter pins and post mold metalisation provide significant cost savings over traditional manufacturing techniques.

	Lead Frames These electrical component lead frames require flash free molding throughout multimillion piece production runs.

	Motors Encapsulation provided this manufacturer with significant cost savings through the elimination of end brackets, connectors and numerous manufacturing steps.

	Sensors A nylon resin modified for encapsulation was used to overmold this sensor. A wall section of .010 inches was achieved in front of the Hall IC without damaging the micro-capacitors on the flexible circuit.

	Solenoids Thermoplastic encapsulation is the most common packaging solution for solenoids. Tooling can be easily modified to produce multiple design configurations and the high productivity of thermoplastic makes it cost competitive with other manufacturing approaches.

	Switches The durability of thermoplastic and the ease with which electrical conductors can be overmolded makes it a versatile choice in switch manufacturing.

	Toroids LCP was used by this toroid manufacturer to develop components capable of withstanding surface mount soldering while keeping thermoplastic wall sections under .015 inches.

	Transformers This transformer manufacturer chose thermoplastic because it reduced the thermal rise of the device while providing complete environmental protection. By choosing a material with a high modulus and high elongation lamination vibration is dampened so welding is unnecessary.


	Encap Technologies, Inc. \| 640 S. Vermont St. \| Palatine IL 60067 \| 510-337-2700 info@encaptech.com \| © 2003-06 Encap Technologies, Inc. All rights reserved.