Enhanced Thermal Conductivity
In most cases, encapsulation of a coil wound device with a standard thermoplastic will lead to lower thermal rise. Although plastic is thought of as a thermal insulator, conduction of heat through plastic is generally more effective than convection through air.

Encap was hired by GE to assist in the development and implementation of a new class of thermally conductive materials, with conductivity in the range of 0.3 W/m K to 50 W/m K.

Key benefits of encapsulation with thermally conductive thermoplastics include:

• Reduced thermal rise and hot spot temperatures
  
  
• Downsizing of system and components
  
  
• Reduction in system material costs
  
  
• Movement to lower UL class requirement
  
  
• Increase in electronic component life