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Potting consists of placing componentry in a potting cup then pouring a potting compound into the vessel. This compound may be either air- or oven-cured depending upon the type of material used. This manufacturing process traditionally has offered superior levels of thermal conductivity and corona resistance. However, with new thermally conductive, electrically insulating thermoplastics, thermal rise can be reduced even below the level of todays thermally conductive potting compounds. Like the tape and varnish approach, however, potting tends to be very labor and time intensive. Again, the three dimensional moldability of thermoplastics offers ways to add additional functionality into the part without adding extra components or manufacturing steps. No harmful volatile organic compounds (VOCs) are released as they are with many potting compounds. In addition, the process has a faster cycle time because thermoplastics eliminate several steps. You no longer need to mold a potting cup, insert the delicate componentry into the cup, and do the labor-intensive potting operation or the oven-curing step. While potting cure times can last from one to forty-eight hours, thermoplastic encapsulation cycle times are generally from ten to sixty seconds. This has allowed some companies to dramatically reduce the cost of work-in-process. Thermoplastics generally perform better in thermal cycle, have a smaller size and lighter weight, and are more durable. Again, UL and the IEC have preapproved regulatory systems, and the potential exists to significantly reduce total system cost.
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| Encap Technologies,
Inc. |
640 S. Vermont St. | Palatine
IL 60067
| 510-337-2700 info@encaptech.com | © 2003-06 Encap Technologies, Inc. All rights reserved. |